The system employs a magnetron target assembly, argon discharge plasma, giving a fine-grain, cool sputtering of thin metal films.
      
Specifications:

• Rotating sample table
• Turbo molecular pumped
• Shutter assembly
• Film thickness monitor
• Available materials: Ag, Al, Au, Au/Pd, Cr, Ge
• Sample-size: up to 100 mm wafer

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